Samsung memory chief, Nvidia CEO discuss next-generation HBM cooperation - The Korea Times

Samsung Electronics' memory business head Jun Young-hyun met with NVIDIA CEO Jensen Huang in Seoul to discuss long-term cooperation in next-generation high-bandwidth memory (HBM) technologies. The mee... Read original →

Samsung’s high-level talks with NVIDIA on HBM4E/HBM5 signal a pivotal realignment in AI hardware dominance, not just another supply chain discussion. Technically, Samsung’s potential entry into NVIDIA’s next-gen stack will pressure TSMC to accelerate CoWoS capacity and force SK hynix to fast-track HBM5 ramp, tightening the integration of memory, logic, and advanced packaging. Geopolitically, as U.S. AI chip export controls intensify, HBM has become a new compliance flashpoint—any capacity allocation involving Taiwan, China or Korea must now factor in BIS rule volatility, inflating supply chain redundancy costs. Market-wise, while SK hynix retains NVIDIA’s top partner status, Samsung’s IDM advantage and improved 3D TSV yields position it to trade performance reliability for market share. Within 18 months, HBM will evolve from a peripheral component to a defining element of AI chips; firms securing early HBM5 validation slots will command pricing power and ecosystem influence in the 2027 large-model arms race.