Samsung Electronics' chip chief says discussed next-generation foundry, HBM cooperation with Nvidia CEO - The Economic Times

Samsung Electronics' co-CEO Jun Young-hyun met with NVIDIA CEO Jensen Huang in Seoul to discuss future semiconductor cooperation, particularly focusing on next-generation foundry chips and high-bandwi... Read original →

Samsung and NVIDIA’s deepening collaboration on HBM4E/HBM5 and advanced foundry nodes will accelerate the industry shift toward memory-compute co-optimization, pressuring TSMC and SK Hynix to expedite CoWoS and HBM stacking integration. Tightening U.S. export controls necessitate supply chain redundancy—especially in >12-layer TSV yield and AI accelerator IP licensing—potentially raising compliance costs by 15–20%. In response, TSMC may fast-track A16/A14 capacity for AMD and Broadcom, while Micron pushes its HBM5 alternative to secure NVIDIA’s second-source status. Within 18 months, this alliance will likely breach the 2TB/s HBM bandwidth threshold and force standardization in EDA and advanced packaging, cementing a U.S.-South Korea-centric high-performance computing ecosystem that marginalizes non-integrated foundries.