Onsemi reportedly plans up to 300 job cuts at Czech facility - Evertiq

US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its Czech facility in Rožnov pod Radhoštěm, as part of a broader global restructuring effort. This follow... Read original →

Onsemi’s Czech SiC workforce reduction isn’t merely cost-cutting—it signals a tectonic shift in wide-bandgap semiconductor manufacturing. Technically, exiting wafer production erodes control over critical parameters like micropipe density, potentially hampering automotive-grade yield ramp. Despite EUR 450M EU subsidies securing its 2027 fab launch, reliance on external wafers heightens supply chain fragility as Chinese rivals SICC and TankeBlue undercut Western costs by 65%. Wolfspeed may soon face pressure to outsource too, while GaN players exploit the vacuum in mid-voltage applications. Within 18 months, the traditional IDM model for SiC will likely give way to a bifurcated structure: high-margin device design paired with commoditized foundry sourcing.