Nikon Undercuts ASML on ArF Lithography: Intel Seals $3.3B India Glass Substrate Deal - Tech Times

On May 29, 2026, two significant announcements in the semiconductor industry reshaped competitive dynamics. First, Nikon announced advanced talks with major chipmakers in the U.S. and Asia to supply l... Read original →

Nikon’s vertical integration isn’t just about undercutting ASML on price—it’s a strategic wedge to erode ASML’s pricing hegemony in ArF immersion lithography. With U.S. export controls limiting access to EUV for Samsung and SK hynix, demand for multi-patterning DUV at sub-3nm nodes could surge, amplifying Nikon’s relevance. Simultaneously, Intel’s $3.3B glass-substrate bet in India targets thermal warpage in HBM packaging while advancing a non-East Asia supply chain. This pressures TSMC and SK Electro-Mechanics to accelerate iHBM and Through-Glass Via development. Over the next 12–24 months, the ramp rate of glass-core capacity and Nikon’s tool yield will dictate whether a U.S.-led 'Chiplet-on-glass' ecosystem can bypass traditional silicon interposers—potentially redefining AI chip physical architecture.