Memory maker SK hynix files for $29B US IPO amid AI demand - SiliconANGLE

SK hynix, the world's largest supplier of HBM (High Bandwidth Memory), has filed for a $29 billion IPO on Nasdaq amid surging demand from artificial intelligence applications. The company, which produ... Read original →

SK hynix’s Nasdaq filing is less about capital raising and more a strategic maneuver in the AI memory arms race. Its thermal innovations—MR-MUF and iHBM—have become critical enablers for NVIDIA’s Blackwell architecture, forcing Micron to fast-track TSV and D2D PHY integration. While U.S. CHIPS Act subsidies are enticing, domestic content rules will compel costly redundant fabs outside Yongin, inflating capex. With TSMC’s 3nm CoWoS capacity maxed out, HBM-logic co-design is shifting from optional to mandatory, reshaping EDA flows and test protocols. Over the next 18 months, the HBM4 ramp timeline will decide market leadership: if SK hynix deploys EUV-enabled micro-stacking first, it could lock in over 70% of the premium AI memory segment, widening the performance gap beyond rivals in the U.S. and Taiwan, China.