Imec’s Patrick Vandenameele: Full-stack Innovation Is the Name of the Game

At imec's ITF World 2026 conference, CEO Patrick Vandenameele outlined five key technology shifts expected to reshape the semiconductor landscape over the next decade: system-wide co-optimization in t... Read original →

Imec’s full-stack co-optimization signals a decisive shift from Moore’s Law scaling to system-level re-architecture. Technically, silicon photonics and chiplets will force EUV and 3nm nodes to prioritize interconnect density, while memory bottlenecks drive DRAM/SRAM integration directly into AI chip packages. Geopolitically, the XTCO paradigm increases reliance on neutral R&D hubs like imec, compelling supply chains—especially in Taiwan, China and South Korea—to reassess IP-sharing boundaries under export controls. Strategically, ASML may fast-track High-NA EUV co-development with photonics integration, while NVIDIA could acquire silicon photonics startups to secure bandwidth leadership. Within 12–24 months, manufacturable silicon qubits will ignite capital battles across EDA, cryogenic packaging, and test equipment, raising entry barriers across the stack.