How Will The Custom HBM Business Work?

With the introduction of HBM4, customized high-bandwidth memory (cHBM) is emerging as a new trend in the semiconductor industry. This technology enables companies to tailor memory base dies according ... Read original →

The commercialization of HBM4 is reshaping the semiconductor supply chain. Technologically, customized high-bandwidth memory drives deeper integration between DRAM and logic process nodes, especially at 3nm and below, where finFET and EUV optimizations are critical. By embedding memory controllers into base dies, cHBM reduces host chip footprint, improving AI compute efficiency. This shift undermines traditional memory controller standardization, accelerating the evolution of interfaces like UCIe and AXI. Although memory supply remains tight, modular cHBM designs may alleviate constraints, particularly for NVIDIA and Marvell in hyperscale data centers. However, the mismatch between slow standardization and rapid customization could intensify competitive dynamics. Over the next 12 to 24 months, leading players like TSMC, Samsung, and SK Hynix will likely engage in strategic alliances or exclusivity battles over cHBM ecosystems, reshaping both technical barriers and profit distribution.