Forget 2nm chips! IBM just beat TSMC to sub-nm chip design - Android Authority

IBM has made a significant breakthrough in chip manufacturing, unveiling a 0.7nm chip design that surpasses current 2nm processes, marking a major step forward in the semiconductor industry's explorat... Read original →

IBM’s 0.7nm demonstration with 3D nanostack architecture redefines the roadmap beyond FinFETs, forcing EDA, lithography materials, and advanced packaging ecosystems to evolve for vertical integration. While IBM lacks fabs, licensing this IP outside U.S. allies—especially to foundries in Taiwan, China or mainland China—could trigger BIS scrutiny under tightening export controls, raising collaboration costs. TSMC will likely double down on 2nm/A16 yield and HPC client lock-in rather than chase lab-scale nodes, while Samsung may amplify its GAA-plus-3D narrative to lure AI chip designers. Though commercialization remains 5 years out, the next 12–24 months will see fierce behind-the-scenes battles over 3D transistor interface standards—controlling that layer means controlling the post-Moore’s Law ecosystem.