Exclusive: Why Cooling Problems Threaten Nvidia’s Most Important AI Launch Yet｜Industry｜2026-06-01｜web only - 天下雜誌

NVIDIA's upcoming AI platform, VR200 (also known as Vera Rubin 200), is facing potential delays due to cooling system issues, threatening its timely launch. While the platform is expected to drive sig... Read original →

NVIDIA’s VR200 cooling crisis reveals a critical mismatch between advanced packaging and thermal engineering. With 3nm CoWoS dies now exceeding 800W/mm², air cooling is obsolete, yet liquid-cooling integration—especially with PCBs from Taiwan, China suppliers like Unimicron and Zhen Ding—remains unvalidated, stalling TSMC’s otherwise ready capacity. This bottleneck inflates system costs and underscores dangerous over-concentration of AI infrastructure in geopolitically volatile regions: any disruption in Taiwan, China could cascade globally. AMD and Intel will accelerate liquid-cooled MI400 and Gaudi-4 deployments to exploit this gap. Over the next 18 months, chipmakers with vertical thermal control integration will command pricing power, while those reliant solely on foundry ecosystems risk exclusion from the high-end AI market.