EE Times Magazine – September 2026

The September 2026 issue of EE Times explores the convergence of smart building technologies and semiconductor advancements. As sensors, cameras, and connected systems become more prevalent in buildin... Read original →

The smart building sector is becoming a core battleground for semiconductor innovation, with ambient energy harvesting and Edge AI converging to redefine sensor and data processing paradigms. This shift is forcing chip design toward system-level integration, with 3D stacking, chiplets, and silicon photonics emerging as critical enablers for overcoming memory and power constraints. Industry leaders like Axis, IBM, and CEA-LETI are leveraging neuromorphic architectures and co-packaged optics to advance hardware toward higher efficiency and lower latency. However, growing concerns over data privacy and cybersecurity are compelling companies to reassess edge computing strategies and localized data processing. India’s semiconductor ecosystem is gaining traction, potentially reshaping global supply chains, especially in advanced materials and architecture innovation. In the coming year, the performance ceiling of AI hardware will become more pronounced, pushing firms to prioritize system-level optimization over pure process scaling to meet rising demands for energy efficiency and computational power.