Daeduck Electronics targets 2029 ceramic substrates for AI packaging

Daeduck's ceramic core substrate bet is fundamentally a timing play against glass substrate yield risk. Once AI packaging exceeds 120mm, organic ABF substrates hit their physical ceiling while glass core yield remains unproven at scale. Ceramics slot into that gap as a "third pole" — not a permanent winner, but a bridge material with a 2029 qualification window. The technical ripple is immediate: CCS validation forces a re-audit of the ABF film (Ajinomoto), copper foil (Panasonic), and underfill supply chains. CTE-matching properties of ceramics will rewrite stress simulation models in 2.5D/3D packaging, compressing TSV pitch further. On competition: Intel and SKC's Absolics target glass core mass production in 2028-2030. Daeduck's 2029 ceramic timeline deliberately occupies the vacuum where glass yield is unstable but organic substrates can no longer support the area. Ibiden and Shinko will likely accelerate their own ceramic programs by 2027 to lock in design wins. The 12-24 month inflection: H2 2026, when NVIDIA Rubin Ultra and AMD MI400 freeze their packaging specs, will determine whether CCS enters the BOM. If it does, Q1 2027 sample submissions trigger a capex cycle in laser drilling and metallization equipment — Disco and Besi benefit first.