www.purdue.edu
2026-05-28
Purdue University
Purdue, GCCS partner to scale the future of silicon carbide
Joint initiative targets critical thermal and power bottlenecks in global AI infrastructure
Dan DeLaurentis, Purdue’s executive vice president for research, left, and Kuan-Ming Hsiung, GeChi Compound Semiconductor Co. chairman of the board, signed a research memorandum of understanding at Hovde Hall. The agreement will strengthen collab
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.