China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls - digitimes

According to assessments from UBS and Zeiss, China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, underscoring the persistent technological gap in replicat... Read original →

The prolonged delay in mastering EUV lithography will significantly hinder China's semiconductor industry's path toward self-reliance. While progress in DUV technology offers partial relief, the absence of EUV capabilities will constrain advanced chip production, limiting domestic supply. Western exporters like ASML maintain dominant control over critical equipment, creating a strategic bottleneck for China’s manufacturing ambitions. In response, SMIC and others are ramping up R&D efforts in materials and process innovation, yet the technological gap remains formidable. TSMC’s leadership in advanced nodes further widens the divide. Over the next 12–24 months, China may seek alternative partnerships or domestic breakthroughs, but systemic restructuring will take time. Geopolitical tensions are accelerating supply chain fragmentation, pushing China to balance autonomy with global integration.