Industry Analysis
China’s aggressive push into advanced packaging is triggering a structural reshuffle across the global semiconductor stack. JCET and SJSemi’s new 3D integration lines alleviate pressure on interposer and TSV supply for HBM, yet CXMT’s HBM3 yield issues reveal a critical gap in EUV-enabled front-end capabilities—proving packaging alone can’t substitute node scaling in the post-Moore era. India’s entry via CG Semi offers the West a nascent 'de-risking' alternative, though it won’t displace Southeast Asia’s OSAT dominance soon. Meanwhile, GlobalFoundries’ SLATE and ADI’s Empower acquisition underscore that power delivery and 3D RF are now pivotal bottlenecks for AI chips. Over the next 18 months, U.S.-China tech decoupling will force Chinese OSATs to vertically integrate silicon capacitors and IVRs, while TSMC’s CoWoS capacity constraints may compel NVIDIA to accept suboptimal packaging—slowing AI hardware cadence.
This page displays AI-generated summaries and metadata for research purposes. Original content belongs to the respective publishers.