USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 - PR Newswire

On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The ... Read original →

USI’s SiC chip-embedded packaging at PCIM marks a strategic pivot from discrete power devices to system-level integration. By fusing ABF substrates with ceramic insulation and eliminating wire bonds, it directly undermines conventional DBC/AMB modules, pressuring upstream material suppliers to develop hybrid substrates with superior thermal conductivity and CTE matching. Geopolitically, deployment via USI’s China Taiwan facilities may trigger EU scrutiny under the Critical Raw Materials Act, raising compliance overhead for automotive clients. While Wolfspeed and Infineon push monolithic SiC integration, USI counters with advanced packaging—but faces looming competition from TSMC (China Taiwan) in 3D heterogeneous integration. Within 18 months, this approach will likely set benchmarks in >400V EV onboard chargers and liquid-cooled AI data center PSUs, cementing ‘packaging-as-system’ as the new paradigm in power electronics.