USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 - acrofan.com

USI, a global leader in electronic design and manufacturing services, has unveiled a breakthrough in advanced power semiconductor packaging technology at PCIM Europe 2026. The company successfully emb... Read original →

USI’s SiC-embedded packaging breakthrough at PCIM Europe 2026 signals a strategic pivot from chip-centric to system-level power integration. By co-integrating SiC dies into ABF substrates with ceramic insulation and eliminating wire bonds, it forces upstream ABF suppliers to accelerate CTE-matched material R&D while compressing downstream module assembly steps. Geopolitically, reliance on Japanese ABF—amid potential U.S. export controls under the CHIPS Act—could raise supply chain risk premiums by 15–20%. Facing vertical integration by Infineon, ROHM, and Hitachi in SiC modules, USI (a TSMC group company based in Taiwan, China) may leverage its OSAT-IDM synergy to dominate EV and AI data center markets via end-to-end co-design. Within 18 months, this architecture is poised to become the de facto standard for 800V platforms and humanoid robot actuators, pushing SiC adoption beyond the 35% inflection point.