1016 articles
2026-05-14
tomshardware.com
2026-05-14
Mark Tyson
A tech enthusiast has combined an Nvidia GeForce RTX 3070 (8GB) with defective memory and an AMD Radeon RX 6900 XT (16GB) with a damaged GPU to make a working RTX 3070 with 16GB of VRAM.
2026-05-14
www.tomshardware.com
2026-05-14
Tom's Hardware
ShareCopy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this articleJoin the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterAll three leading-edge foundries — Intel Foundry, Samsung Foundry, and TSMC — have initiated mass production of chips using 2nm-class process technology. Samsung was the first one to start production using itsSF2 node
2026-05-14
www.techtimes.com
2026-05-14
Tech Times
South Korean memory chipmakersSamsung ElectronicsandSK hynixposted pre-market gains on Wednesday morning, May 14, as Wall Street's overnight rally in AI semiconductor stocks and the opening ofthe Trump-Xi Beijing summitlifted risk appetite on the Korea Exchange—even asa blowout April producer-price readingrattled bond markets.Trump and Xi Begin Beijing Talks on Chips, Tariffs, and Rare EarthsThe s
2026-05-14
tomshardware.com
2026-05-14
Zhiye Liu
Singularity Computers has announced the Portal Advanced, an open wall-mounted display case with liquid-cooling support, starting at $499.
2026-05-14
tomshardware.com
2026-05-14
Denise Bertacchi
Right-to-repair feud gets aggressive.
2026-05-14
tomshardware.com
2026-05-14
Bruno Ferreira
At this rate, candlemaker stocks are looking promising.
2026-05-14
www.thelec.net
2026-05-14
thelec.net
1Samsung Display, LG Display to Supply OLED Panels for Apple iPhone 18 Pro Models2Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC3WIRobotics Raises 95 Billion Won in Series B Funding4Samsung Electronics, Union to Resume Wage Talks Ahead of Strike Deadline5Samsung Electronics Union Faces Growing Backlash Over 45 Trillion Won Bonus Demand6Global Semiconductor Packaging Market
2026-05-14
www.trendforce.com
2026-05-14
TrendForce
HomeNews
2026-05-14
www.digitimes.com
2026-05-14
digitimes
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen...The article requires paid subscription.Subscribe Now
2026-05-14
semiengineering.com
2026-05-14
Semiconductor Engineering
Key Takeaways:Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability.Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out.AI is beginning to
2026-05-14
www.digitimes.com
2026-05-14
digitimes
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute...The article requires paid subscription.Subscribe Now
2026-05-14
www.fool.com
2026-05-14
The Motley Fool
When it comes to the artificial intelligence (AI) boom,Nvidia(NVDA+2.33%)is the stock by which all others are measured. The company supplies the semiconductors that enabled the recent advances in AI, and it has been one of the undeniable beneficiaries of the AI revolution. Despite concerns about growing competition, uncertainty about future AI adoption, and economic and geopolitical uncertainty, N
2026-05-14
www.digitimes.com
2026-05-14
digitimes
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued that the AI revolution is advancing far...The article requires paid subscription.Subscribe Now
2026-05-14
www.digitimes.com
2026-05-14
digitimes
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now
2026-05-14
www.fool.com
2026-05-14
The Motley Fool
Memory chip stocks have been scorching hot in recent months, driven by a massive shortage amid AI demand.Two of the biggest winners have beenMicron(MU+4.72%)andSandisk(SNDK0.56%). Micron is one of the three large, diversified memory companies, along with the Korean giantsSamsungandSK Hynix, while Sandisk was spun off fromWestern Digitallast year and specializes in NAND flash memory.As you can see
2026-05-14
www.fool.com
2026-05-14
The Motley Fool
Nvidia(NVDA+2.33%)is set to report its fiscal first-quarter 2027 results after the market closes on May 20. Heading into the report, shares sit near record highs, up about 21% year to date as of this writing. The AI chipmaker has also guided for fiscal first-quarter revenue of about $78 billion -- a forecast that implies approximately 75% year-over-year growth.So why am I not buying ahead of what
2026-05-14
www.trendforce.com
2026-05-14
TrendForce
HomeNews
2026-05-14
www.digitimes.com
2026-05-14
digitimes
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.The article requires paid subscription.Subscribe Now
2026-05-14
www.fool.com
2026-05-14
The Motley Fool
These catalysts could create momentum forQualcomm(QCOM+1.07%)stock.*Stock prices used were the afternoon prices of May 11, 2026. The video was published on May 13, 2026.
2026-05-14
digitimes.com
2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man