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As logic devices transition from FinFETs to more complex gate-all-around (GAA) architectures, manufacturing variability has become a major barrier to achieving high yield. Traditional wafer-based optimization methods are slow, expensive, and limited in addressing multiple failure modes simultaneousl

Lam's digital twin technology application in GAA logic manufacturing represents a significant advancement in semiconductor fabrication toward higher precision and efficiency. This technology constructs virtual manufacturing environments that can monitor and optimize critical production parameters in