Semiconductor News & Analysis Feed
17 articles
2026-09-28
www.jconline.com
2026-09-28
2026-09-23
www.starcitytv.com
2026-09-23
2026-09-23
www.innovationnewsnetwork.com
2026-09-23
2026-09-23
www.insideindianabusiness.com
2026-09-23
2026-09-22
news.google.com
2026-09-22
2026-09-22
grainger.illinois.edu
2026-09-22
The Purdue–Illinois semiconductor workforce partnership signals a maturing, systemic approach to addressing the structural talent deficit in U.S. microelectronics. Rather than competing for limited enrollment, two of the nation's top engineering schools are pooling curricula, industry relationships,
2026-08-28
www.expreview.com
2026-08-28
2026-08-28
2026-08-28
www.purdueexponent.org
2026-08-28
2026-08-28
www.jconline.com
2026-08-28
2026-08-28
www.purdue.edu
2026-08-28
2026-08-21
www.purdueexponent.org
2026-08-21
2026-07-09
www.purdueexponent.org
2026-07-09
A judge in West Lafayette, Indiana, ruled that the notice regarding the rezoning of land for SK Hynix's chip manufacturing plant was sufficient, dismissing a lawsuit filed by plaintiff Lora Williams. The case centers on whether proper public notice was given during the rezoning process, which would
2026-06-18
stories.prf.org
2026-06-18
A delegation from Purdue University recently visited Taiwan's Ministry of Economic Affairs and Ministry of Education to deepen cooperation between Taiwan and the United States in science, technology, talent, and industry. The discussions centered on third-generation semiconductors, artificial intell
2026-05-30
www.purdueexponent.org
2026-05-30
A judge in Tippecanoe County, Indiana, has set a December 1–3 trial date for a civil lawsuit involving SK Hynix, a Korean semiconductor manufacturer, and local residents over the construction of a $3.87 billion facility in West Lafayette. The case centers on allegations that inadequate legal notice
2026-05-28
www.purdue.edu
2026-05-28
Purdue University and GeChi Compound Semiconductor Co. (GCCS) have entered a five-year collaboration to accelerate the commercialization of silicon carbide (SiC) technology, addressing critical thermal and power bottlenecks in global AI infrastructure. This strategic partnership combines GCCS's expe
2026-05-08
stories.prf.org
2026-05-08