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Trending Technologies
EUV204 3nm179 AI92 HBM89 AI chips84 DRAM84 GPU70 memory chips55 semiconductor25 AI infrastructure24 NAND flash23 NAND19 2nm18 chip manufacturing17 AI chip16
2026-05-11
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test - digitimes
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www.digitimes.com 2026-05-11 digitimes
DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.The article requires paid subscription.Subscribe Now
Semiconductor IndustryChip DesignWafer FoundrySupply ChainInvestment AnalysisTechnology NewsMarket DynamicsTechnology Development
2026-05-11
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029 - digitimes
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www.digitimes.com 2026-05-11 digitimes
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant,...The article requires paid subscription.Subscribe Now
Semiconductor PackagingAdvanced PackagingTaiwan Semiconductor IndustryAI Chip DemandWafer Fab ExpansionSemiconductor Equipment InvestmentSupply Chain IntegrationChip Manufacturing
2026-05-11
Wooptix Targets AI Packaging Bottleneck with Astronomy Tech
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eetimes.com 2026-05-11 Pat Brans
A Canary Islands startup brings wavefront imaging to semiconductor metrology, aiming to tackle wafer shape challenges in 3D integration.
Semiconductor PackagingAI ChipsAdvanced Packaging3D IntegrationWavefront SensingAstronomy TechnologyWafer MetrologyWafer Warpage
2026-05-11
TrendForce Sees Tightening Advanced Packaging and 3nm Capacity as AI Competition Turns Into a Supply Chain Arms Race - EE Times Asia
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news.google.com 2026-05-11 EE Times Asia
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2026-05-09
SÜSS MicroTec SE stock: Semiconductor equipment maker eyes growth in advanced packaging and lithogr - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-09 AD HOC NEWS
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2026-05-09
Global Semiconductor Packaging Market to Exceed $618 Billion in 2026, KPCA Says - thelec.net
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www.thelec.net 2026-05-09 thelec.net
1Samsung Display, LG Display to Supply OLED Panels for Apple iPhone 18 Pro Models2Bezos-Backed Prometheus Startup Raises $10 Billion Without a Prototype3DRAM Prices Seen Rising Up to 48% in Q2 as Pace of Gains Slows4SK hynix Says Hybrid Bonding HBM Yield Improved5Qualcomm to Ship First Data-Center Chips This Year6Galaxy S26 Ultra Uses Qualcomm Snapdragon 8 Elite 5th Gen7Samsung Electronics Targets
Semiconductor PackagingMarket ForecastKPCAOLED PanelsApple iPhoneDRAM PricesSK HynixHBM
2026-05-08
Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - The Globe and Mail
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www.theglobeandmail.com 2026-05-08 The Globe and Mail
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2026-05-08
Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Yahoo! Finance Canada
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ca.finance.yahoo.com 2026-05-08 Yahoo! Finance Canada
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2026-05-08
Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Yahoo Finance
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finance.yahoo.com 2026-05-08 Yahoo Finance
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2026-05-08
Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Zacks Investment Research
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www.zacks.com 2026-05-08 Zacks Investment Research
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2026-05-08
Does Applied Materials’ NEXX Deal and AI Packaging Push Reshape the Bull Case for AMAT? - simplywall.st
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simplywall.st 2026-05-08 simplywall.st
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2026-05-08
Malaysia to develop advanced semiconductor packaging capability in 2 years - Free Malaysia Today
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www.freemalaysiatoday.com 2026-05-08 Free Malaysia Today
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2026-05-08
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead - digitimes
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www.digitimes.com 2026-05-08 digitimes
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources...The article requires paid subscription.Subscribe Now
TSMCCoPoSAdvanced PackagingAI SemiconductorsSemiconductor ManufacturingCoWoSEUV LithographyChip Packaging
2026-05-08
Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia
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theedgemalaysia.com 2026-05-08 The Edge Malaysia
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2026-05-08
Govt bets on five local semiconductor companies capturing 7% of global advanced packaging market by 2035 - KLSE Screener
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www.klsescreener.com 2026-05-08 KLSE Screener
KUALA LUMPUR (May 8): The Malaysian government has provided RM92 million in  research and development (R&D) grants to five local companies that form the Malaysia Advanced Packaging Consortium (MAPC) to help upgrade the country’s semiconductor industry into a higher-value sector, according to the Ministry of Science, Technology and Innovation (Mosti).The funding, channelled through the Malaysia Sci
Semiconductor IndustryAdvanced PackagingMalaysian GovernmentR&D InvestmentTechnology PolicyArtificial IntelligenceSupply Chain ResilienceHigh-Value Manufacturing
2026-05-08
Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia
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theedgemalaysia.com 2026-05-08 The Edge Malaysia
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2026-05-08
MOSTI pushes Malaysia towards high-value semiconductor future with advanced packaging drive - The Vibes
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www.thevibes.com 2026-05-08 The Vibes
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2026-05-08
KLIC Q1 Deep Dive: Accelerating Demand and Advanced Packaging Expansion Drive Outlook - StockStory
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stockstory.org 2026-05-08 StockStory
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2026-05-08
Malaysia's local semiconductor players are making their advanced packaging move, and the stakes could not be higher - CRN Asia
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www.crnasia.com 2026-05-08 CRN Asia
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2026-05-07
Following CoWoS, will the next generation of advanced packaging be CoPoS? - 富途牛牛
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news.futunn.com 2026-05-07 富途牛牛
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Advanced PackagingSemiconductor PackagingCoWoS TechnologyChip PackagingSemiconductor ManufacturingTechnology DevelopmentPackaging TechnologyChip Design