Semiconductor News & Analysis Feed
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2026-06-17
www.indexbox.io
2026-06-17
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2026-06-17
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2026-06-17
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2026-06-17
TrendForce
[News] TSMC, Amkor Sign 10-Year Arizona Advanced Packaging Pact to Complete the U.S. Chip Supply Chain
2026-06-17 Semiconductors editor
News
Please note that this article cites information from Amkor, ESM China, and Reuters.
TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties h
2026-06-17
www.digitimes.com
2026-06-17
digitimes
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
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2026-06-17
digitimes.com
2026-06-17
The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into a pressure point for advanced semiconductor packaging.
2026-06-17
digitimes.com
2026-06-17
Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity in Malaysia, aiming to capture demand from a shifting global semiconductor supply chain.
2026-06-17
digitimes.com
2026-06-17
India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.
2026-06-17
digitimes.com
2026-06-17
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
Taiwan Semiconductor Manufacturing (NYSE:TSM) And Amkor Sign 10 Year Arizona Packaging Deal
Bailey Pemberton
Tue, June 16, 2026 at 3:12 PM PDT 3 min read
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TSMC
2026-06-17
marklapedus.substack.com
2026-06-17
Semiecosystem
TSMC, Amkor Form Packaging/Test Partnership
This establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services
SEMIECOSYSTEM
JUN 17, 2026
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By Mark LaPedus
TSMC and Amkor Technology have formed a major and long-term partnership in the advanced packaging and test arena in the United States.
The 10-year agreement establishes a collaboration f
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
Lam Research (LRCX) Is Betting On Advanced Packaging For 50% Growth In 2026
Bailey Pemberton
Tue, June 16, 2026 at 1:09 PM PDT 4 min read
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Lam Research is highlighting its advanced packaging business as a key
2026-06-17
www.gurufocus.com
2026-06-17
GuruFocus
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2026-06-17
www.nokia.com
2026-06-17
Nokia
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2026-06-17
www.sphericalinsights.com
2026-06-17
Spherical Insights
According to market research firm Spherical Insights, which has been working in the semiconductor, advanced packaging, chip manufacturing, artificial intelligence hardware, and electronics supply chain industry for the last 10 years, their market study indicates that the global advanced chip packaging market is experiencing substantial growth and is expected to expand significantly through 2035.
2026-06-16
www.tradingview.com
2026-06-16
TradingView
News
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Q: AI-driven demand and advanced packaging fuel double-digit growth and deeper OEM partnerships
Q: AI-driven demand and advanced packaging fuel double-digit growth and deeper OEM partnerships
Less than 1 min read
Q
−5.45%
Qnity is capitalizing on AI and advanced packaging trends, driving strong growth in data centers and industrial markets. Its end-to-end materials portfolio, rapi
2026-06-16
www.theglobeandmail.com
2026-06-16
The Globe and Mail
Lam Research Corporation’s LRCX advanced packaging business is emerging as an important growth driver. With artificial intelligence (AI) driving major changes in chip design, this business could become a meaningful catalyst for future growth.
Unlike traditional semiconductor manufacturing, AI chips require advanced packaging techniques to connect multiple processors and memory components in a com
2026-06-16
www.theglobeandmail.com
2026-06-16
The Globe and Mail
Lam Research Corporation’s LRCX advanced packaging business is emerging as an important growth driver. With artificial intelligence (AI) driving major changes in chip design, this business could become a meaningful catalyst for future growth.
Unlike traditional semiconductor manufacturing, AI chips require advanced packaging techniques to connect multiple processors and memory components in a com
2026-06-16
www.investing.com
2026-06-16
Investing.com
www.investing.com
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2026-06-16
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