Semiconductor News & Analysis Feed
541 articles
2026-06-19
biz.chosun.com
2026-06-19
Chosunbiz
By
Jeong Du-yong
Published 2026.06.19. 09:49
Former SK hynix CEO Lee Seok-hee. /Courtesy of SK On
Intel has hired former SK hynix CEO (president) Lee Seok-hee as executive vice president of the foundry (semiconductor contract manufacturing) institutional sector. Lee, who also served as SK On CEO (president), is regarded as a veteran in Korea's semiconductor and manufacturing industries. In April
2026-06-19
mezha.net
2026-06-19
mezha.net
Intel appoints Seok Hee Lee to lead advanced packaging and contract manufacturing
Friday, 19 June 2026, 02:32
Intel tapped a seasoned chip industry leader to drive its packaging and system integration push, aiming to rebuild foundry momentum and speed deployment of 18A and 14A nodes.
As mentioned by Reuters
On June 18, Intel named Seok-Hee Lee as executive vice president of its contract chip ma
2026-06-19
marklapedus.substack.com
2026-06-19
Semiecosystem
Intel Names New Advanced Packaging Chief
Intel has reorganized its foundry unit, naming a new executive to lead its packaging business
SEMIECOSYSTEM
JUN 19, 2026
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By Mark LaPedus
Intel has reorganized its foundry unit and appointed a new executive to lead its efforts in the advanced packaging business.
Seok-Hee Lee, formerly president and chief executive of SK On, has been appointed a
2026-06-19
eciks.org
2026-06-19
eciks.org
Seok-Hee Lee appointed Intel EVP to lead advanced packaging
Published on 18 June 2026 at 6:18 pm •
Written by Chris Martin
• Reading duration : 2 minutes · read 74 times
© Seok-Hee Lee appointed Intel EVP to lead advanced packaging
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Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, tasking him with leading the company’s advanced packaging, system inte
2026-06-19
wccftech.com
2026-06-19
Wccftech
Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO.
Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, syste
2026-06-19
www.globalbankingandfinance.com
2026-06-19
Global Banking & Finance Review
Intel has appointed semiconductor veteran Seok‑Hee Lee as executive vice president of its foundry contract manufacturing division to lead advanced packaging, system integration, and back‑end operations, sharpening its push into advanced packaging amid a resurgence under CEO Lip‑Bu Tan.
June 18 (Reuters) - Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufactu
2026-06-19
www.tradingview.com
2026-06-19
TradingView
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2026-06-18
simplywall.st
2026-06-18
simplywall.st
United States/Semiconductors/NasdaqGM:ACMR
Is ACM Research’s (ACMR) Advanced Packaging Momentum Quietly Rewriting Its AI Chip Tool Narrative?
June 18, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
In recent days, ACM Research reported strong first-quarter growth, highlighted robust order momentum at its Shanghai subsidiary, and saw semiconductor equipment peers lift expectations for wafer fab eq
2026-06-18
eetimes.com
2026-06-18
Catalonia is unifying its fragmented tech ecosystem into a coordinated semiconductor cluster spanning photonics, packaging, AI, and chip research.
2026-06-18
digitimes.com
2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com
2026-06-18
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.
2026-06-18
biz.chosun.com
2026-06-18
Chosunbiz
By
Jeong Du-yong
Published 2026.06.18. 06:02
Glass substrate from Appslix, SKC's semiconductor substrate manufacturing subsidiary./Courtesy of Appslix
TSMC, the world's largest foundry (contract semiconductor manufacturing) corporations, disclosed verification results for the commercialization of glass semiconductor substrates developed in an ecosystem centered on Taiwan and Japan. As a result,
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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ACM Research: Advanced Packaging Just Getting Started, Keep Holding Your Gains
Jun 17, 2026, 12:39 PM ETACM Research, Inc. (ACMR) Stock
Gytis Zizys
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ACM Research, Inc. delivered strong Q1 results, with 34% y/y revenue growth and significant outperformance in ECP and Furnace segments.
Gross margins rebounded sequentially to
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.indexbox.io
2026-06-17
IndexBox
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2026-06-17
www.tradingview.com
2026-06-17
TradingView
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How is Onto Innovation Capitalizing on Advanced Packaging Demand?
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
3 min read
ONTO
+4.38%
Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI comput
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
Shivangi Deora
Wed, June 17, 2026 at 5:10 AM PDT 4 min read
ONTO
+4.23%
AMAT
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KLAC
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Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its posi