Semiconductor News & Analysis Feed
20 articles
2026-08-18
thequantuminsider.com
2026-08-18
2026-08-02
www.phoronix.com
2026-08-02
2026-07-28
news.google.com
2026-07-28
2026-07-24
www.newswire.com
2026-07-24
2026-07-12
news.google.com
2026-07-12
2026-07-09
stocktwits.com
2026-07-09
Recent NVIDIA stock performance has drawn market attention, with one analyst upgrading its rating from a simple 'buy' to 'enhanced buy,' reflecting optimistic market expectations for continued growth in AI chip demand. As a global leader in AI computing, NVIDIA dominates key sectors including data c
2026-07-08
www.openpr.com
2026-07-08
According to a recent report by market research firm Fact.MR, the global F-15EX GaN-enhanced fighter radar market is projected to grow from USD 1.53 billion in 2026 to USD 3.27 billion by 2036, registering a CAGR of 7.9%. This growth is primarily driven by the increasing demand for advanced radar te
2026-06-24
marklapedus.substack.com
2026-06-24
Quantum Computing Inc. (QCi), a U.S.-based quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S. advanced packaging vendor. The deal, valued at $73.1 million in cash and stock, with potential additional payments up to $72 million based on performance, expands QCi's capabi
2026-06-22
www.thinkgeoenergy.com
2026-06-22
Fervo Energy, NVIDIA, and PNNL have announced a collaboration to develop an enhanced geothermal digital twin platform, marking a significant step in leveraging advanced digital technologies to improve renewable energy efficiency. This partnership demonstrates the energy industry's shift toward digit
2026-06-22
www.quiverquant.com
2026-06-22
On June 22, 2026, Fervo Energy (Nasdaq: FRVO), NVIDIA, and the Pacific Northwest National Laboratory (PNNL) announced a collaboration to develop the next-generation digital twin platform for Enhanced Geothermal Systems (EGS), named EGS-Twin. Designed to provide real-time insights into subsurface beh
2026-06-19
finance.yahoo.com
2026-06-19
ON Semiconductor (ON) launched its GaNEXUS gallium nitride power portfolio on June 9, 2026, aimed at enhancing system efficiency, thermal performance, and power density. The lineup includes FETs ranging from 40V to 650V, with integrated protection features in 650V Smart GaN FETs to improve reliabili
2026-06-17
tomshardware.com
2026-06-17
At VLSI 2026, Intel unveiled further details of its enhanced 18A-P process, a refinement of its 18A node aimed at boosting performance and reducing power consumption. The 18A-P process delivers a 9% performance gain at the same power level or an 18% power reduction at the same performance, while als
2026-06-16
www.gurufocus.com
2026-06-16
Murata Manufacturing's partnership with Synopsys represents a significant development in semiconductor design tools, as both companies leverage their respective expertise to enhance simulation capabilities. This collaboration is particularly important given the industry's increasing demand for sophi
2026-06-10
news.google.com
2026-06-10
2026-06-09
www.01net.it
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. This development addresses critical challenges in modern chip manufacturing, particularly in high-performance computing and AI
2026-06-09
www.gurufocus.com
2026-06-09
Cadence's expanded partnership with Intel Foundry represents a strategic move to enhance process optimization capabilities in advanced semiconductor manufacturing. This collaboration underscores the industry's critical need for sophisticated process optimization as chip fabrication advances toward 3
2026-06-09
www.marketscreener.com
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. As chip performance demands continue to rise, traditional packaging methods struggle to meet increasing integration requiremen
2026-06-09
finance.yahoo.com
2026-06-09
On June 8, 2026, Qnity Electronics announced the introduction of two enhanced advanced packaging materials designed for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These materials are tailored to support advanced in
2026-06-09
www.marketscreener.com
2026-06-09
Qnity Electronics has introduced enhanced advanced packaging material solutions for organic interposer applications, marking a significant development in semiconductor packaging technology. This advancement addresses critical challenges in modern chip manufacturing as processes scale down to advance
2026-06-09
www.mycarrollcountynews.com
2026-06-09
Qnity Electronics has introduced two enhanced advanced packaging materials for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These innovations are designed to support advanced interconnect formation, redistribution la