Semiconductor News & Analysis Feed
20 articles
2026-07-28
www.openpr.com
2026-07-28
2026-07-24
www.electronicdesign.com
2026-07-24
2026-07-21
chargedevs.com
2026-07-21
2026-07-17
www.hackster.io
2026-07-17
2026-07-16
www.indexbox.io
2026-07-16
2026-07-15
www.bisinfotech.com
2026-07-15
2026-07-15
2026-07-14
news.google.com
2026-07-14
2026-07-09
www.openpr.com
2026-07-09
The silicon carbide (SiC) traction modules market is experiencing significant momentum as the global electric vehicle (EV) industry accelerates its transition toward high-voltage 800V architectures and next-generation traction inverter technologies. According to Fact.MR, the market is projected to r
2026-07-08
www.autocarpro.in
2026-07-08
MAHLE and Infineon have collaborated to develop a specialized cooling architecture for data center power modules, addressing thermal challenges in high-current electronic systems. The project focuses on Infineon's new EasyPACK S module, designed for controlling power supply and switchgear in data ce
2026-07-08
manufacturing.economictimes.indiatimes.com
2026-07-08
MAHLE's development of a cooling unit for Infineon's power modules represents a significant advancement in thermal management for data center applications. This collaboration addresses the growing demand for efficient heat dissipation solutions in high-power density computing environments. As data c
2026-06-18
tomshardware.com
2026-06-18
According to Nelson Duann, Senior Vice President of Silicon Motion, Chinese manufacturers of memory modules and SSDs hold a significant advantage over their American and Taiwanese counterparts due to government policies encouraging domestic chipmakers to supply local industries such as DRAM modules,
2026-06-18
timestech.in
2026-06-18
Infineon's CIPOS Prime 1200V CoolSiC power modules are now available through Mouser Electronics, a leading NPI distributor for semiconductors and electronic components. Designed for high-performance automotive applications in xEVs, these modules integrate automotive-grade CoolSiC MOSFETs in a compac
2026-06-17
2026-06-15
www.electronicsforyou.biz
2026-06-15
2026-06-12
www.ad-hoc-news.de
2026-06-12
Texas Instruments (TI) launched two compact isolated DC/DC power modules on June 12, 2026, targeting high-power-density designs in electric vehicles and data centers. These modules are engineered to deliver high power density while maintaining a small footprint, making them ideal for systems with ti
2026-06-12
www.digitimes.com
2026-06-12
As wide-bandgap semiconductors like silicon carbide (SiC) and gallium nitride (GaN) gain prominence in electric vehicle powertrains, electronic packaging engineers face mounting thermal challenges. The PCIM 2026 conference highlights the critical issue of thermal warping in direct-cooled EV power mo
2026-06-12
2026-06-12
inspenet.com
2026-06-12
Siemens and Infineon have announced a collaboration to introduce SENTRON 3QD2 modules incorporating silicon carbide (SiC) technology, aimed at enhancing energy efficiency and safety in critical industrial environments. These modules, based on Infineon's CoolSiC MOSFET technology, are integrated into
2026-06-10
www.electronicsweekly.com
2026-06-10