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2026-09-14
FCS Group Secures Exclusive Taiwan and Southeast Asia Distribution Rights for CKST Glass Substrate Equipment, Targeting AI Advanced Packaging - finance.biggo.com
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finance.biggo.com 2026-09-14
2026-09-10
AUO matching glass substrate size stokes TSMC collab speculation
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digitimes.com 2026-09-10
2026-09-09
LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up
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digitimes.com 2026-09-09
2026-09-08
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection - The Malaysian Reserve
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themalaysianreserve.com 2026-09-08
2026-09-01
Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan
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digitimes.com 2026-09-01
2026-08-31
Glass Substrate: Comprehensive Industry Development Roadmap, Market Trends & Future Innovation Path - 36氪
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eu.36kr.com 2026-08-31
2026-08-27
AI glass substrate race shifts toward reliability and mass production
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digitimes.com 2026-08-27
2026-08-25
EO Technics Rises Toward Target on HBM Back-End Equipment Dominance and Glass Substrate Growth Prospects - finance.biggo.com
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finance.biggo.com 2026-08-25
2026-08-23
Glass Substrates Emerge as Chip Battleground; Korea's HBM Lead Hinges on Packaging - Seoul Economic Daily
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en.sedaily.com 2026-08-23
2026-08-14
Samsung Electro-Mechanics Delays Semiconductor Glass Substrate Investment - thelec.net
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news.google.com 2026-08-14
2026-08-03
Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
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digitimes.com 2026-08-03
2026-07-31
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging
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digitimes.com 2026-07-31
2026-07-29
Shanghai Aishengna: The Secretive Company Behind China’s Latest DUV Lithography Push Thoroughly Unmasked, As Beijing Hedges With Glass Substrates And An EUV Prototype - Wccftech
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wccftech.com 2026-07-29
2026-07-29
China's glass substrate supply chain takes shape for AI chip packaging
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digitimes.com 2026-07-29
2026-07-25
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging - digitimes
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www.digitimes.com 2026-07-25
Intel's strategic collaboration with Lens Technology to explore glass substrate semiconductor packaging represents a significant advancement in advanced packaging technologies. Glass substrates offer superior electrical and thermal performance, enabling enhanced chip integration and performance. Thi
Semiconductor packagingGlass substrateIntelWafer fabricationSemiconductor technologyChip manufacturingAdvanced packagingSemiconductor supply chain
2026-07-25
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
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digitimes.com 2026-07-25
2026-07-24
Lens Technology Partners with Intel to Jointly Pursue TGV Glass Substrate Advanced Packaging - finance.biggo.com
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finance.biggo.com 2026-07-24
Lens Technology and Intel have announced a strategic partnership to jointly explore the application of Through-Glass Via (TGV) technology in next-generation advanced packaging. This collaboration marks Lens Technology's strategic expansion from consumer electronics precision manufacturing into the s
Glass SubstrateAdvanced PackagingTGV TechnologySemiconductor IndustryIntel PartnershipLens TechnologyGlass CoverSemiconductor Manufacturing
2026-07-18
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
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digitimes.com 2026-07-18
2026-07-13
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging - PR Newswire
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news.google.com 2026-07-13
2026-07-13
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging - Morningstar
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news.google.com 2026-07-13