Semiconductor News & Analysis Feed
181 articles
2026-06-03
www.engineering.com
2026-06-03
Engineering.com
Its co-packaged optics are intended to help scale bandwidth, reduce latency and ease power limits in rack-scale AI systems.
Ayar Labs announced it has joined the NVIDIA NVLink Fusion ecosystem, and making its products optically and electrically compatible with NVIDIA optical and SerDes technologies. This allows hyperscalers and system innovators to build optically-connected AI infrastructure arou
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
etfdb.com
2026-06-03
ETF Database
etfdb.com
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2026-06-02
www.thelec.net
2026-06-02
thelec.net
Infineon's 1300V HybridPack Drive SiC module. (Photo: Infineon)
Infineon Technologies said it is supporting Nvidia's MGX platform with new power management solutions designed for next-generation 800VDC AI data center architectures.
The company said May 29 it unveiled technologies capable of converting 800VDC power into lower server-level voltages including 50V, 12V and 6V for use inside AI serve
2026-06-02
www.semiconductors.org
2026-06-02
Semiconductor Industry Association | SIA
Semiconductors are the foundation of artificial intelligence (AI), a technology that is transforming our economy and society, making entire industries more productive and innovative, and driving major scientific breakthroughs.
Today’s AI systems are built on decades of innovation across the entire semiconductor ecosystem. As chip technologies continue to advance, AI will become more capable, ener
2026-06-02
www.electronicsforyou.biz
2026-06-02
Electronics For You BUSINESS
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2026-06-02
www.ad-hoc-news.de
2026-06-02
AD HOC NEWS
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2026-06-01
www.ad-hoc-news.de
2026-06-01
AD HOC NEWS
Infineon’s, Triple
Infineon’s Triple Catalysts: Price Hikes, NVIDIA Ecosystem, and a New Dresden Fab Power a Record Run
01.06.2026 - 11:21:55 | boerse-global.de
Infineon stock reaches €83.27 as AI data center revenue soars, price increases take effect, and Dresden fab opens early, signaling structural demand shift.
Infineon’s Triple Catalysts: Price Hikes, NVIDIA Ecosystem, and a New Dresden Fab
2026-06-01
www.ad-hoc-news.de
2026-06-01
AD HOC NEWS
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2026-06-01
www.ad-hoc-news.de
2026-06-01
AD HOC NEWS
Infineons, Record
Infineon's Record Rally Gains a Dual Catalyst: NVIDIA Ecosystem Entry and GaN Patent Victory
01.06.2026 - 07:42:17 | boerse-global.de
Infineon shares hit €81.81, up 113.6% in 2026, driven by NVIDIA AI factory partnership, GaN patent win, and raised revenue forecast above €16 billion.
Infineon's Record Rally Gains a Dual Catalyst: NVIDIA Ecosystem Entry and GaN Patent Victory -
2026-06-01
www.cnbc.com
2026-06-01
CNBC
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2026-06-01
blogs.nvidia.com
2026-06-01
NVIDIA Blog
NVIDIA AI Cloud Ecosystem Expands Worldwide to Meet Global AI Compute Demand
Fast-growing ecosystem helps enterprises, startups, nations, AI labs and developers scale agentic AI applications.
May 31, 2026 by Dion Harris
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The NVIDIA AI Cloud ecosystem is accelerating the global buildout of AI factory infrastructure. Partners are expanding capacity to meet growing demand from enterprises,
2026-06-01
simplywall.st
2026-06-01
simplywall.st
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2026-06-01
news.google.com
2026-06-01
EE Times India
2026-06-01
news.google.com
2026-06-01
EE Times Asia
2026-05-31
www.chosun.com
2026-05-31
조선일보
By Park Ji-min
Published 2026.06.01. 00:34
NVIDIA CEO Jensen Huang introduces the next-generation AI platform 'Vera Rubin' at the company's annual conference 'GTC 2026' in March last year. /AFP-Yonhap
NVIDIA, which dominates the artificial intelligence (AI) semiconductor market, is now eyeing the PC semiconductor sector. Axios reported on the 30th of last month (local time) that NVIDIA plans to
2026-05-30
themachinemaker.com
2026-05-30
Machine Maker
themachinemaker.com
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2026-05-30
digitimes.com
2026-05-30
At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
www.digitimes.com
2026-05-30
digitimes
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's...
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