mezha.net
2026-06-19
mezha.net
Intel appoints Seok Hee Lee to lead advanced packaging and contract manufacturing
Friday, 19 June 2026, 02:32
Intel tapped a seasoned chip industry leader to drive its packaging and system integration push, aiming to rebuild foundry momentum and speed deployment of 18A and 14A nodes.
As mentioned by Reuters
On June 18, Intel named Seok-Hee Lee as executive vice president of its contract chip ma