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The custom inference accelerator follows the hyperscaler playbook, but the AI-automated chip design process could prove the more consequential announcement.

EMERGING TECHNOLOGIES Huawei is unveiling a new 3D chip design it says can close the gap with global leaders The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools By Cris Tolomia Share to X Share to Facebook Share to Reddit Share to Email Share to Link Published 16 minutes ago