Semiconductor News & Analysis Feed

OpenAI has unveiled its custom-designed AI inference chip, named Jalapeño, set for deployment at 'Gigawatt scale' with data center partners across multiple generations. While the company did not specify against which technology it is benchmarking performance, it claims the first-generation accelerat

Huawei unveiled its novel 3D chip architecture, LogicFolding, at the IEEE International Symposium on Circuits and Systems, claiming it can achieve transistor density equivalent to 1.4nm processes by 2031 without access to advanced lithography tools. The technique folds traditional flat circuits into