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Trending Technologies
EUV43 3nm37 AI12 GPU11 HBM9 AI chips8 2nm7 DRAM6 EPYC6 semiconductor5 DDR55 Zen 65 memory4 AI chip4 Venice4
2026-05-05
NY Creates, Micron start workforce training program for chip workers - Times Union
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www.timesunion.com 2026-05-05 Times Union
ALBANY — NY Creates and Idaho-based chipmaker Micron Technology have started a 16-month apprenticeship program in the Capital Region.
2026-05-05
3D chip design solution lifts Synopsys stock 1.75% amid bullish technical momentum - Traders Union
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tradersunion.com 2026-05-05 Traders Union
2026-05-05
DAC 2026 Heads to Long Beach This July as AI Drives Growth Across Chip Design - HPCwire
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www.hpcwire.com 2026-05-05 HPCwire
2026-05-05
Qualcomm’s AI Chips And Automotive Growth Reshape Its Investment Story - Yahoo Finance
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finance.yahoo.com 2026-05-05 Yahoo Finance
2026-05-05
Broadcom, Qualcomm, or TSMC: Why One AI Chip Stock Won Decisively in April - 24/7 Wall St.
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247wallst.com 2026-05-05 24/7 Wall St.
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2026-05-04
Bhavish Aggarwal-led Krutrim pivots from building AI models, chip design to cloud services - Moneycontrol.com
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news.google.com 2026-05-04 Moneycontrol.com
2026-05-04
NVIDIA’s AI Chip Market Share in China Falls to Zero, CEO Jensen Huang Says - Techloy
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www.techloy.com 2026-05-04 Techloy
2026-05-04
Barclays Boosts SK Hynix and Samsung Price Targets Amid Strengthening Memory Chip Market - Blockonomi
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blockonomi.com 2026-05-04 Blockonomi
2026-05-04
ADT lands US AI chip deal using Samsung 4nm - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
MediaTek hires former TSMC executive to boost AI chip packaging - Reuters
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www.reuters.com 2026-05-04 Reuters
2026-05-04
L&T Semiconductor Technologies joins imec automotive chiplet program, aiming to shape global vehicle electronics - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
Applied Materials strikes NEXX deal as AI chip packages shift to larger panels - Stock Titan
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www.stocktitan.net 2026-05-04 Stock Titan
2026-05-04
Designing Chips In The Context Of Rapidly Evolving AI
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semiengineering.com 2026-05-04 Ann Mutschler
Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compu...
AI chip designEdge AIChip architectureComputational performanceMemory hierarchyData movementRAS technologyMultimodal AI
2026-05-03
CHIPS Act: Semiconductor Industry - Deloitte
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www.deloitte.com 2026-05-03 Deloitte
2026-05-03
User Clip: House Debate, CHIPS Act - C-SPAN
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www.c-span.org 2026-05-03 C-SPAN
2026-05-03
Four major smartphone brands hike India prices amid chip shortage - MSN
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www.msn.com 2026-05-03 MSN
2026-04-30
NoC Coherency Challenges Balloon With AI SoCs And Chiplets
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semiengineering.com 2026-04-30 Liz Allan
Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. C...
Network-on-ChipAI SoCChipletsCache CoherencyData MovementSystem IntegrationMulti-die DesignNoC Architecture
2026-04-30
Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out
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eetimes.com 2026-04-30 Sally Ward-Foxton
The startup has ditched multi-vendor chiplets for a powerful in-house design, promising safety, scalability, and aggressive pricing.
Chip DesignFunctional SafetyAutomotive ChipsChipletAutonomous DrivingSemiconductor ManufacturingChip PackagingSupply Chain
2026-04-23
Why Chip Sovereignty Is No Longer About Chips—But Systems
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eetimes.com 2026-04-23 Pat Brans
Exclusive interviews with Mark Papermaster, CTO of AMD, and Chris Miller, author of “Chip War” and professor at Tufts University
Semiconductor IndustryAI AcceleratorsSystem-Level DesignChip SovereigntyAdvanced PackagingChip ManufacturingGlobal Supply ChainComputing Architecture
2026-04-22
TSMC Unfolds Map for Process, Packaging Tech
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eetimes.com 2026-04-22 Alan Patterson
TSMC unveils chip tech roadmap, slashing AI power use and boosting density.
TSMCAdvanced ProcessAI Chip3nmEUV LithographyPackaging TechnologyPhotonicsData Center