Semiconductor News & Analysis Feed
20 articles
2026-08-12
finance.biggo.com
2026-08-12
Taiwanese semiconductor equipment maker Grand Process (3131.TW) announced a significant strategic move by partnering with Japan's Seiki Semiconductor Co., Ltd. through its subsidiary Jialin Technology to distribute advanced bonding and precision surface treatment equipment. This collaboration addres
2026-07-23
2026-07-21
2026-07-20
2026-07-19
www.indexbox.io
2026-07-19
2026-07-17
2026-07-16
semiengineering.com
2026-07-16
Hybrid bonding has transitioned from research to production, yet achieving high-volume manufacturing remains a significant challenge. While wafer-to-wafer bonding has demonstrated reliable large-scale integration, fine-pitch die-to-wafer bonding introduces new complexities due to increased sensitivi
2026-07-16
semiengineering.com
2026-07-16
Hybrid bonding is emerging as a critical technology for achieving the high interconnect density required by high-bandwidth workloads. As semiconductor processes advance toward smaller nodes, traditional copper-silicon dioxide bonding is becoming inadequate for meeting increasing density demands. Ind
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-09
www.digitimes.com
2026-07-09
Samsung Electronics and SK Hynix may delay their adoption of hybrid bonding technology for next-generation high-bandwidth memory (HBM), according to reports from Digitimes. This adjustment reflects weakened near-term commercial viability for hybrid bonding despite its long-term strategic importance.
2026-07-09
2026-07-07
news.google.com
2026-07-07
2026-07-06
news.futunn.com
2026-07-06
2026-07-06
news.google.com
2026-07-06
2026-07-01
www.azom.com
2026-07-01
Photo-patternable bonding technology is emerging as a critical enabler in advanced device manufacturing, offering integrated adhesion and patterning in a single layer that streamlines traditional processes and enhances material utilization. This approach is particularly valuable in MEMS, sensor manu
2026-06-26
www.techtimes.com
2026-06-26
Samsung Electronics has provided the first quantitative evidence that hybrid copper bonding (HCB) outperforms conventional thermo-compression bonding (TCB) in thermal management for next-generation high-bandwidth memory (HBM). As memory stacks grow taller, heat becomes the primary performance limiti
2026-06-24
finance.yahoo.com
2026-06-24
BE Semiconductor Industries (BESIY), a Netherlands-based semiconductor assembly equipment company, is capitalizing on the growing demand for hybrid bonding technology to expand its role in AI chip packaging. At its 2026 Investor Day, the company raised its long-term revenue target to €1.7–2.2 billio
2026-06-19
www.tradingview.com
2026-06-19
BESI's latest report reveals that hybrid bonding and advanced packaging technologies are experiencing rapid growth, driven by upgraded targets and accelerated AI-driven adoption. Hybrid bonding technology, as a core component of advanced packaging, is propelling the semiconductor industry toward hig
2026-06-13
news.google.com
2026-06-13