Semiconductor News & Analysis Feed
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2026-06-16
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2026-06-16
WSTM
Convicted rapist and kidnapper Christopher E. Block was returned to the custody of law enforcement days after his release from prison.
OSWEGO, N.Y. — Leaders across Oswego County say they are already preparing for the massive impact Micron is expected to have on Central New York, but many acknowledge the region is not ready yet.
For the third year in a row, community leaders, educators and econo
2026-06-16
www.digitimes.com
2026-06-16
digitimes
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had...
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2026-06-16
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Exclusive: Qualcomm in Talks to Buy Tenstorrent to Expand AI Chip Capabilities
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2026-06-16
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2026-06-16
International Business Times
By
Matias Civita
Published 06/15/26 AT 3:34 PM EDT
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The technology giant is returning to the U.S. investment-grade bond market for the first time since June 2021, when it raised $5 billion through a debt offering. JUSTIN SULLIVAN/GETTY IMAGES
NVIDIA is reportedly preparing to raise approximately $20 billion
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
China, GaN
China GaN Ban Tests Infineon's AI Data Center Momentum as Forward P/ E Hits 34x
15.06.2026 - 21:05:17 | boerse-global.de
Infineon accelerates €5B Dresden fab to 2026, but patent dispute in China forces halt of GaN sales. AI power chip revenue forecast to grow, stock up 111% YTD.
China - China GaN Ban Tests Infineon's AI Data Center Momentum as Forward P/E Hits 34x 15.06.2026 - Bild: ü
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.
2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
Mexico Business News
Nvidia is preparing a US$20 billion corporate bond issuance, marking its first investment-grade debt offering in five years. The transaction reflects growing capital requirements across the AI ecosystem and highlights how leading technology companies are using debt markets to finance infrastructure, product development, and balance sheet management.
Nvidia plans to raise US$20 billion through a U
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-16
easternherald.com
2026-06-16
The Eastern Herald
The Phone That Cost Twice as Much to Build: How the Chip Crisis Landed on Your Next Smartphone Bill
From Nvidia's AI supply agreements to the EU's Chips Act 2.0, the forces reshaping smartphone pricing are structural — and far from resolved.
BY TECHNOLOGY DESK
JUNE 15, 2026
Silicon carbide (SiC) chips, a key component in modern semiconductors, are at the centre of a structural global shortage. [I
2026-06-16
www.indexbox.io
2026-06-16
IndexBox
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