Semiconductor News & Analysis Feed
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2026-06-25
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2026-06-25
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2026-06-25
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2026-06-25
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How AI fueled SK Hynix's rise
The Korean memory maker is seeking to raise $29 billion on Wall Street
JÉRÔME MARIN
JUN 25, 2026
Share
Just three years ago, SK H
2026-06-25
news.futunn.com
2026-06-25
富途牛牛
__fail__
2026-06-25
digitimes.com
2026-06-25
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing equipment facility in Munich, the Commission announced. The approval is the latest step in Brussels' push to reduce Europe's reliance on foreign chip technology and strengthen its industrial autonomy.
2026-06-25
digitimes.com
2026-06-25
National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai Xinsheng Semiconductor Technology, in a restructuring aimed at easing losses in its wafer business.
2026-06-25
digitimes.com
2026-06-25
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand driven by semiconductor capacity expansion. Together with its subsidiaries Han-Yang Technology Renewable Energy and Sunlight Environment, the company has a combined annual treatment capacity of 239,000 tons.
2026-06-24
www.thediplomat.ro
2026-06-24
The Diplomat Bucharest
HomeNewsGunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
Gunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
NEWS
TOP STORIES
TECHNOLOGY
PUBLISHED ON
JUNE 24, 2026
BY
PETRE BARAC
Strong university partnerships, thriving technology ecosystems and targeted funding mechanisms are es
2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
2026-06-24
digitimes.com
2026-06-24
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon, the independent subsidiary is set to begin production this year, a decade after IBM began exploring applications of quantum computing.
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-23
www.musicbusinessworldwide.com
2026-06-23
Music Business Worldwide
NVIDIA HIT WITH US COPYRIGHT SUIT CLAIMING IT TRAINED AI MODELS ON WINAMP SUBSIDIARY JAMENDO’S MUSIC WITHOUT PERMISSION
19
SHARES
JUNE 23, 2026
BY MANDY DALUGDUG
Photo credit: gguy / Shutterstock.com
Jamendo, the music licensing platform owned by Belgium-headquartered Winamp Group, has filed a lawsuit in the United States against tech giant Nvidia. Jamendo accuses the chipmaker of using copyrig
2026-06-23
digitimes.com
2026-06-23
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator, extending the companies' supply relationship from mobile and PC chips into server-class semiconductors, ZDNet Koreareported.
2026-06-22
www.digitimes.com
2026-06-22
digitimes
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS...
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2026-06-22
digitimes.com
2026-06-22
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources said the first wave of demo equipment has already been installed at VisEra, a TSMC subsidiary.
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-20
www.ad-hoc-news.de
2026-06-20
AD HOC NEWS
TSMC’s, Booking
TSMC’s Booking Bonanza: Fully Subscribed to 2028 as Clients Eye Samsung and CoWoS Expansion Ramps
20.06.2026 - 16:28:21 | boerse-global.de
TSMC's advanced nodes fully booked by Nvidia, Apple, and others; clients like BYD, AMD, and Google explore Samsung. Stock near €414 record, capital budget at $52-56B for 2026.
TSMC’s - TSMC’s Booking Bonanza: Fully Subscribed to 2028 as Client
2026-06-19
tomshardware.com
2026-06-19
Bruno Ferreira
Tesco UK supermarket chain moves 40,000 servers off of VMWare infrastructure — mass exodus continues thanks to Broadcom's pricing shenanigans
2026-06-18
www.tradingkey.com
2026-06-18
TradingKey
Micron Technology shares rose nearly 5% to approach historical highs on June 18, Eastern Time, driven by sustained demand for AI-linked HBM and high-end DRAM. Following a 253% year-to-date rally, the firm has joined the trillion-dollar market cap club. Major investment banks maintain bullish ratings, with UBS setting a $1,625 target. Investors are now focused on the June 24, Eastern Time, earnings