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Transcend to spotlight AI-ready enterprise SSDs and DDR5 memory at COMPUTEX 2026

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digitimes.com 2026-05-27

Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s

SK hynix unveils cooling-integrated HBM for AI systems - upi.com

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www.upi.com 2026-05-27 upi.com

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HBM Memory Technology AI Chips Semiconductor Storage Cooling Technology SK Hynix Artificial Intelligence Chip Manufacturing

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers - Tom's Hardware

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www.tomshardware.com 2026-05-26 Tom's Hardware

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SK Hynix integrating cooling into next-gen high-bandwidth memory chips - Blocks & Files

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www.blocksandfiles.com 2026-05-26 Blocks & Files

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SK Hynix unveils iHBM integrated cooling for next-gen HBM products - Crypto Briefing

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cryptobriefing.com 2026-05-26 Crypto Briefing

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SK hynix launches iHBM integrated cooling solution for next-generation AI memory chips - Vietnam Investment Review - VIR

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vir.com.vn 2026-05-26 Vietnam Investment Review - VIR

SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b

SK hynix HBM memory AI chips thermal management 3D stacking chip packaging semiconductor materials memory chips

SK hynix Unveils Cooling-Integrated HBM - Businesskorea

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www.businesskorea.co.kr 2026-05-26 Businesskorea

The Company Says iHBM Cuts Thermal Resistance By Over 30% SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix) SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era

HBM Cooling Technology Semiconductor AI Chips Memory Technology SK Hynix 3D Stacking Thermal Management

Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026

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digitimes.com 2026-05-26

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo

ADATA outlines cloud-to-edge AI ecosystem and cost-cutting AI Scaler at COMPUTEX 2026

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digitimes.com 2026-05-26

ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant

Assessing Synopsys (SNPS) Valuation As Ansys Integration And AI Chip Initiatives Support Growth Expectations - simplywall.st

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simplywall.st 2026-05-26 simplywall.st

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Kawasaki partners with Nvidia and Microsoft to integrate AI with robotics at new center in San Jose, California - report - Data Center Dynamics

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news.google.com 2026-05-22 Data Center Dynamics

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Quantinuum and Synopsys Partner to Integrate Quantum Algorithms into Engineering Simulation Workflows - Quantum Computing Report

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news.google.com 2026-05-20 Quantum Computing Report

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