242 articles
2026-05-14
digitimes.com
2026-05-14
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve
2026-05-14
digitimes.com
2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man
2026-05-14
www.tradingview.com
2026-05-14
TradingView
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2026-05-14
finance.yahoo.com
2026-05-14
Yahoo Finance
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2026-05-14
finance.yahoo.com
2026-05-14
Yahoo Finance
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2026-05-13
markets.financialcontent.com
2026-05-13
FinancialContent
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2026-05-13
www.foreignpolicyjournal.com
2026-05-13
foreignpolicyjournal.com
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
www.tradingview.com
2026-05-13
TradingView
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2026-05-13
consent.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
digitimes.com
2026-05-13
Moore Threads has entered a strategic partnership with Lightwheel Intelligent (Beijing) Technology (Lightwheel.ai) to jointly develop a domestic simulation and synthetic data infrastructure platform for embodied AI, highlighting China's broader push to reduce reliance on foreign AI computing and robotics software ecosystems.
2026-05-13
digitimes.com
2026-05-13
As the Iran war and the geopolitical uncertainty it has triggered continue to intensify, global technology supply chains are coming under heavier-than-expected pressure. In addition to surging metal raw material prices, shortages of high-specification ISO containers used to transport helium, as well as specialty industrial solvents, are driving up production costs and threatening the stability of
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
digitimes.com
2026-05-13
Taiwanese printed circuit board maker Zhen Ding Technology Holding reported first-quarter 2026 revenue that reached a record for the period, as booming demand for artificial intelligence infrastructure helped offset the seasonal slowdown typically associated with consumer electronics.
2026-05-13
digitimes.com
2026-05-13
Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington's support to revive its foundry business.
2026-05-13
www.insidermonkey.com
2026-05-13
Insider Monkey
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
stockstory.org
2026-05-13
StockStory
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2026-05-13
www.tradingview.com
2026-05-13
TradingView
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2026-05-12
www.theglobeandmail.com
2026-05-12
The Globe and Mail
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