Semiconductor News & Analysis Feed
918 articles
2026-07-04
www.gurufocus.com
2026-07-04
GuruFocus
2026-07-04
www.theglobeandmail.com
2026-07-04
The Globe and Mail
2026-07-04
www.theglobeandmail.com
2026-07-04
The Globe and Mail
2026-07-04
finance.yahoo.com
2026-07-04
Yahoo Finance
2026-07-04
www.fool.com
2026-07-04
The Motley Fool
2026-07-03
www.theglobeandmail.com
2026-07-03
The Globe and Mail
2026-07-03
www.theglobeandmail.com
2026-07-03
The Globe and Mail
2026-07-03
finance.yahoo.com
2026-07-03
Yahoo Finance
2026-07-03
www.tradingview.com
2026-07-03
TradingView
2026-07-03
www.zacks.com
2026-07-03
Zacks Investment Research
2026-07-03
tomshardware.com
2026-07-03
Anton Shilov
Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.
2026-07-03
www.benzinga.com
2026-07-03
Benzinga
2026-07-03
seekingalpha.com
2026-07-03
Seeking Alpha
2026-07-03
uk.finance.yahoo.com
2026-07-03
Yahoo Finance UK
2026-07-03
finance.yahoo.com
2026-07-03
Yahoo Finance
2026-07-03
eciks.org
2026-07-03
eciks.org
2026-07-03
digitimes.com
2026-07-03
China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.
2026-07-03
digitimes.com
2026-07-03
With supply chain inventory normalization largely complete, Sonix Technology (Sonix) has seen business momentum recover. The MCU supplier is benefiting from resilient demand for microcontrollers used in medical monitoring devices and steady shipments of multimedia image-processing chips, giving it better order visibility for 2026 than in previous years. Meanwhile, the company's drone business has
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
digitimes.com
2026-07-03
Infineon has opened its new Smart Power Fab in Dresden ahead of schedule, adding capacity for chips used in AI data centers, electric vehicles, renewable energy, and industrial systems. The move expands Europe's semiconductor base, strengthens supply chains, and could affect technology markets far beyond Germany and the continent.