241 articles
2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
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2026-05-22
digitimes.com
2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com
2026-05-22
InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support global market expansion and large-scale growth. The firm said the appointment aims to leverage the adviser's semiconductor leadership experience to guide worldwide strategy and help scale the company's business in i
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-22
digitimes.com
2026-05-22
Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelera
2026-05-22
digitimes.com
2026-05-22
Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.
2026-05-22
digitimes.com
2026-05-22
Taiwan's semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play Silicon Valley May Summit, as investors and defense technology executives described a geopolitical environment that is fundamentally reshaping where capital flows and why.
2026-05-22
digitimes.com
2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.