344 articles
2026-05-14
finimize.com
2026-05-14
Finimize
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2026-05-14
digitimes.com
2026-05-14
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve
2026-05-14
digitimes.com
2026-05-14
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.
2026-05-14
digitimes.com
2026-05-14
The ongoing Samsung Electronics labor dispute highlights sharply different labor models in South Korea and Taiwan, where firms such as TSMC operate with minimal union presence and rely instead on compensation-driven workforce stability. Industry observers say the Samsung conflict reflects broader tensions over profit sharing during the AI-driven semiconductor upcycle, while Taiwan's tech sector co
2026-05-14
digitimes.com
2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man
2026-05-14
digitimes.com
2026-05-14
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued that the AI revolution is advancing far faster than anticipated and is reshaping the industry from generative AI and AI agents to inference computing.
2026-05-14
www.newelectronics.co.uk
2026-05-14
New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
2026-05-14
www.bizjournals.com
2026-05-14
The Business Journals
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2026-05-13
www.eejournal.com
2026-05-13
EEJournal
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2026-05-13
www.theglobeandmail.com
2026-05-13
The Globe and Mail
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2026-05-13
www.bizjournals.com
2026-05-13
The Business Journals
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
news.az
2026-05-13
Latest news from Azerbaijan
News.Az is an Azerbaijani informational-analytical news portal that publishes a wide range of content, including analytical materials,
in-depth articles, insightful commentaries, and the latest news.
2026-05-13
digitimes.com
2026-05-13
TSMC's board of directors approved a US$31.3 billion capital budget on May 12 for advanced-process capacity buildout, factory construction, and fab infrastructure — and separately approved a capital injection of up to US$20 billion into its wholly owned US subsidiary, TSMC Arizona.
2026-05-13
digitimes.com
2026-05-13
The US may soon see Taiwan-style industrial parks, according to officials and industry representatives who recently visited the country to attend a trade summit. The development could see companies in Taiwan's chip ecosystem establish a presence at US locations near TSMC's facilities.
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
www.digitimes.com
2026-05-13
digitimes
TSMC's board of directors approved a US$31.3 billion capital budget on May 12 for advanced-process capacity buildout, factory construction, and fab infrastructure — and separately approved a capital injection of up to US$20 billion into its wholly owned US...The article requires paid subscription.Subscribe Now
2026-05-13
www.thelec.net
2026-05-13
thelec.net
1Samsung Display, LG Display to Supply OLED Panels for Apple iPhone 18 Pro Models2DRAM Prices Seen Rising Up to 48% in Q2 as Pace of Gains Slows3Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC4Qualcomm to Ship First Data-Center Chips This Year5Samsung Electronics Targets Foundry Rebound With HBM4 and Silicon Photonics6Samsung Electronics Posts Record 57.2 Trillion Won Operat
2026-05-13
www.kjzz.org
2026-05-13
KJZZ
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2026-05-13
simplywall.st
2026-05-13
simplywall.st
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