Semiconductor News & Analysis Feed
3679 articles
2026-05-29
www.digitimes.com
2026-05-29
digitimes
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activ
2026-05-29
www.reuters.com
2026-05-29
Reuters
__fail__
2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
telecom.economictimes.indiatimes.com
2026-05-29
ET Telecom
Read and get insights from specially curated unique stories from editorial
Explore and discuss challenges & trends in India's leading B2B events
Recognise work that not only stood out but was also purposeful
Join leaders & experts for roundtables, conferences, panels and discussions
By continuing you agree to our Privacy Policy & Terms & Conditions
We have various options to advertise with us
2026-05-29
www.digitimes.com
2026-05-29
digitimes
Qualcomm Technologies is pushing its Windows-on-Arm strategy into lower-cost laptops with a new Snapdragon C platform, betting that PC makers squeezed by rising memory costs will look for alternatives to traditional x86 chips in the entry-level market.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vis
2026-05-29
www.ndtv.com
2026-05-29
NDTV
Access Denied
You don't have permission to access "http://www.ndtv.com/feature/micron-ceo-sanjay-mehrotra-was-denied-us-visa-3-times-now-heads-1-trillion-firm-11562118" on this server.
Reference #18.a6f10f17.1780045114.182d47c2
https://errors.edgesuite.net/18.a6f10f17.1780045114.182d47c2
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.thelec.net
2026-05-29
thelec.net
Innometri signs a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment. (Photo: Innometri)
Innometri said it signed a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment.
The two companies will cooperate on developing X-ray and computed tomography (CT) systems capable of inspe
2026-05-29
www.stocktitan.net
2026-05-29
Stock Titan
__fail__
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/infineon-joins-nvidia-s-mgxa-ai-factory-ecosystem-to-transform-power-delivery-architecture-for-nex-ce7f5ddad08ef32d" on this server.
Reference #18.4d0f3417.1780113542.d2e028
https://errors.edgesuite.net/18.4d0f3417.1780113542.d2e028
2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon’s, Infrastructure
Infineon’s AI Infrastructure Play Deepens With d-Matrix Tie-Up, Even as the Stock Stretches Into Overbought Territory
29.05.2026 - 03:06:31 | boerse-global.de
Infineon's partnership with d-Matrix and GaN patent win position it at the heart of the data-center power revolution, driving a 109% YTD stock surge to €80.16.
Infineon’s AI Infrastructure Play Deepens With d-Mat
2026-05-29
developer.nvidia.com
2026-05-29
NVIDIA Developer
AI applications are moving beyond text generation to multimodal systems that can perceive, search, and reason across images, documents, video, and language in real time—turning fragmented information into actionable insights.
Step 3.7 Flash, the latest from StepFun, brings these capabilities to production and enterprise-scale, available on NVIDIA-accelerated infrastructure. It is a 198B-paramet
2026-05-29
www.msn.com
2026-05-29
MSN
__fail__
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.