Semiconductor News & Analysis Feed
3657 articles
2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
telecom.economictimes.indiatimes.com
2026-05-29
ET Telecom
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2026-05-29
www.digitimes.com
2026-05-29
digitimes
Qualcomm Technologies is pushing its Windows-on-Arm strategy into lower-cost laptops with a new Snapdragon C platform, betting that PC makers squeezed by rising memory costs will look for alternatives to traditional x86 chips in the entry-level market.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vis
2026-05-29
www.ndtv.com
2026-05-29
NDTV
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2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.thelec.net
2026-05-29
thelec.net
Innometri signs a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment. (Photo: Innometri)
Innometri said it signed a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment.
The two companies will cooperate on developing X-ray and computed tomography (CT) systems capable of inspe
2026-05-29
www.stocktitan.net
2026-05-29
Stock Titan
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2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon’s, Infrastructure
Infineon’s AI Infrastructure Play Deepens With d-Matrix Tie-Up, Even as the Stock Stretches Into Overbought Territory
29.05.2026 - 03:06:31 | boerse-global.de
Infineon's partnership with d-Matrix and GaN patent win position it at the heart of the data-center power revolution, driving a 109% YTD stock surge to €80.16.
Infineon’s AI Infrastructure Play Deepens With d-Mat
2026-05-29
developer.nvidia.com
2026-05-29
NVIDIA Developer
AI applications are moving beyond text generation to multimodal systems that can perceive, search, and reason across images, documents, video, and language in real time—turning fragmented information into actionable insights.
Step 3.7 Flash, the latest from StepFun, brings these capabilities to production and enterprise-scale, available on NVIDIA-accelerated infrastructure. It is a 198B-paramet
2026-05-29
www.msn.com
2026-05-29
MSN
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2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.