www.insidermonkey.com
2026-06-24
ASMPT Limited (ASMVY) has secured a repeat order from a leading global integrated device manufacturer for eight chip-to-wafer Thermo-Compression Bonding (TCB) tools, reinforcing its growing role in high-bandwidth memory (HBM) and AI packaging. The order, announced on June 8, 2026, follows the custom
finance.yahoo.com
2026-06-24
ASMPT Limited (ASMVY) has secured a repeat order for eight chip-to-wafer Thermo-Compression Bonding (TCB) tools from a leading global integrated device manufacturer, reinforcing its growing role in high-bandwidth memory (HBM) and AI packaging. The order, which follows the customer's use of ASMPT's F