technode.global
2026-06-09
TNGlobal
Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital.
The facility includes