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2026-05-21
Wolfspeed’s 300mm SiC Milestone Fuels AI Infrastructure Growth Hopes - simplywall.st
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simplywall.st 2026-05-21 simplywall.st
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2026-05-21
Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN - digitimes
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www.digitimes.com 2026-05-21 digitimes
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2026-05-21
Toshiba Ships 1200V SiC MOSFET Samples for AI Data Centers - World Business Outlook
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worldbusinessoutlook.com 2026-05-21 World Business Outlook
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2026-05-21
Huaxi Securities: AI development is driving significant growth in SiC demand, with SiC substrate and equipment companies expected to benefit substantially. - Moomoo
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www.moomoo.com 2026-05-21 Moomoo
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2026-05-21
Huaxi Securities: AI development is driving significant growth in SiC demand, with SiC substrate and equipment companies expected to benefit substantially. - 富途牛牛
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news.futunn.com 2026-05-21 富途牛牛
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers – News Hub - Medianet News Hub
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newshub.medianet.com.au 2026-05-21 Medianet News Hub
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - The AI Journal
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aijourn.com 2026-05-21 The AI Journal
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - The AI Journal
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aijourn.com 2026-05-21 The AI Journal
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2026-05-21
Toshiba Ships 1200V Trench-Gate SiC MOSFET Samples - Let's Data Science
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letsdatascience.com 2026-05-21 Let's Data Science
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - StreetInsider
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www.streetinsider.com 2026-05-21 StreetInsider
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - Business Wire
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news.google.com 2026-05-21 Business Wire
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - 巴士的報
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www.bastillepost.com 2026-05-21 巴士的報
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - Eagle-Tribune
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www.eagletribune.com 2026-05-21 Eagle-Tribune
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2026-05-21
Toshiba Starts Shipping Test Samples of 1200V Trench-Gate SiC MOSFET that will Enhance Efficiency in Next-Generation AI Data Centers - The Joplin Globe
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www.joplinglobe.com 2026-05-21 The Joplin Globe
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2026-05-21
OpenAI smartphone leaked: ChatGPT cell phone with 2nm chip and AI agents to be released in 2027 - Basic Tutorials
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basic-tutorials.com 2026-05-21 Basic Tutorials
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2026-05-21
Tech Forum 2026: How much longer can semiconductors sustain Taiwan?
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digitimes.com 2026-05-21
During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology transformations, concerns over capital expenditure bubbles among global cloud giants, changes in application-specific integrated circuits (ASICs) and chip architectures, and TSMC's global expansion strategy.
2026-05-21
AI chip boom strains ABF substrate supply chain
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digitimes.com 2026-05-21
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.
2026-05-21
Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN
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digitimes.com 2026-05-21
Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density and design complexity across the data center supply chain. Taiwanese power semiconductor makers are moving into cooling and power-management MOS technologies, as well as higher-spec upgrades.
2026-05-21
Nvidia introduces ACIE sub-segment, adds Anthropic as partner, and breaks out Physical AI
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digitimes.com 2026-05-21
Nvidia introduced a new segment reporting framework on its first quarter of fiscal 2027 call, splitting data center revenue into Hyperscale and ACIE (AI Clouds, Industrial, Enterprise) and breaking out Edge Computing as a separate platform.
2026-05-20
Richardson Electronics partners with NoMIS Power on SiC tech By Investing.com - Investing.com Australia
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au.investing.com 2026-05-20 Investing.com Australia
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