Semiconductor News & Analysis Feed

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced semiconductor capacity and AI server infrastructure creates new demand for precision-engineered components. Companies traditionally focused on powertrain, transmission, and safety systems are leveraging decades of manufacturing expertise to secure positions in semicon

403 - Access Denied Permission denied Status 403 Trace ID 0HNMSUM3F43N7:000000E1 Your IP 47.253.216.184 Request Time 2026-07-08 20:43:35.857 UTC Need help? Contact Us. Please mention your IP: 47.253.216.184

Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand driven by semiconductor capacity expansion. Together with its subsidiaries Han-Yang Technology Renewable Energy and Sunlight Environment, the company has a combined annual treatment capacity of 239,000 tons.

www.astutegroup.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a09ef3a80c9573a3 Performance and Security by Cloudflare Privacy

CanSemi Technology's planned ChiNext listing has exposed the financial strain behind China's push to build mature-node semiconductor capacity, as the Guangzhou-based foundry seeks fresh capital despite persistent losses, negative gross margins and a long road to profitability.

__fail__

As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up