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GlobalFoundries has successfully validated its SLATE advanced packaging technology on the 9SW platform, marking a significant advancement for next-generation RF applications. This validation demonstrates GlobalFoundries' technical capabilities in advanced packaging and strengthens its competitive po

GlobalFoundries has announced that its SLATE™ wafer-to-wafer bonding technology is now production-ready on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, enabling compact and high-performance front-end modules (FEMs) for next-generation 5G devices. Manufactured at i

The AI computing power race is fundamentally reshaping the semiconductor industry's power dynamics, shifting leverage from chipmakers like NVIDIA to grid infrastructure. As AI applications intensify energy demands, the focus has moved beyond traditional chip performance to encompass power efficiency