Semiconductor News & Analysis Feed
2143 articles
2026-07-09
biz.chosun.com
2026-07-09
Chosunbiz
2026-07-09
www.benzinga.com
2026-07-09
Benzinga
2026-07-09
www.kedglobal.com
2026-07-09
The Korea Economic Daily Global Edition
2026-07-09
beincrypto.com
2026-07-09
BeInCrypto
2026-07-09
www.thelec.net
2026-07-09
thelec.net
2026-07-09
www.koreaherald.com
2026-07-09
The Korea Herald
2026-07-09
www.businessinsider.com
2026-07-09
Business Insider
2026-07-09
www.investing.com
2026-07-09
Investing.com
2026-07-09
www.koreajoongangdaily.com
2026-07-09
Korea JoongAng Daily
2026-07-09
www.digitimes.com
2026-07-09
digitimes
2026-07-09
finance.yahoo.com
2026-07-09
Yahoo Finance
2026-07-09
sg.finance.yahoo.com
2026-07-09
Yahoo Finance Singapore
2026-07-09
www.investing.com
2026-07-09
Investing.com
2026-07-09
www.reuters.com
2026-07-09
Reuters
2026-07-09
www.investing.com
2026-07-09
Investing.com
2026-07-09
www.indexbox.io
2026-07-09
IndexBox
2026-07-09
digitimes.com
2026-07-09
The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power while pushing cost pressure into PCs, smartphones, cars, and other end markets.
2026-07-09
digitimes.com
2026-07-09
SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq, where he will personally attend the celebration in New York. The move is being seen as more than a capital market event, as it marks an important moment in SK Hynix's effort to reposition itself from a traditional memory maker into a core company in AI infrastruc
2026-07-09
digitimes.com
2026-07-09
Industrial memory module maker Innodisk reported record June revenue of NT$8.208 billion in 2026, while first-half revenue climbed to about NT$35.626 billion. The gains reflected higher prices and AI-driven memory shortages that kept demand strong through the second quarter.
2026-07-09
digitimes.com
2026-07-09
Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as industry sources cited by ZDNetKoreasay the near-term case for the technology has weakened even though its long-term relevance remains intact.