Semiconductor News & Analysis Feed

The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.

AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.

AI adoption in PCB manufacturing is now widespread, yet fewer than 10% of companies have fully scaled deployments, underscoring a global gap between experimentation and factory-wide integration. For readers worldwide, the findings point to a sector where quality gains are real, but talent, data, and governance constraints are slowing broader industrial change.

分享 LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 01 Jun 2026 More in EDA & Design Software Artificial Intelligence Electronics Board Level Design RECOMMENDED Cadence embraces AI to accelerate PCB and system development Features 5 mins read Artificial intelligence has become a central element of Cadence Design Systems’ broader ‘Intelligent System Design’ strategy, reflecting a shif

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board

Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices for compact portable power designs. The IGK048B041S and IGK120B041S are intended for smartphones, notebooks and wearables, where board space and power-path efficiency remain tight design constraints. For eeNews Europe readers, the update is relevant because it shows how GaN is moving further into low-voltag

Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.

Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.

A maker bored with the staid designs of modern factory-produced PCBs has perfected their own hand-inking and home-etching process.

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