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This article focuses on the key challenges and innovation progress of high-numerical aperture (High-NA) EUV lithography technology in semiconductor manufacturing. As chip processes advance toward 3nm and below, traditional photolithography faces unprecedented challenges, particularly with numerical

As semiconductor processes advance toward more advanced nodes, mask technology is facing unprecedented challenges. While multi-beam writers have significantly reduced mask-writing bottlenecks, defect inspection and repair remain the primary technical constraints. Curvilinear masks are becoming viabl