Semiconductor News & Analysis Feed
21452 articles
2026-06-30
www.sandiegouniontribune.com
2026-06-30
San Diego Union-Tribune
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What Wall Street analysts are saying about Qualcomm’s next act
Analysts weigh in after private panels on Qualcomm's push into one of the fastest-growing markets
Qualcomm President and CEO Cristiano Amon, pictured during the Computex 2026 exhibition in Taiwan, discusses agentic AI a few weeks before he debuts Qualcomm's new datacenter product suite during Investor Day in Ne
2026-06-30
digitimes.com
2026-06-30
Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long dominated by Intel and AMD. The SoftBank-backed chip designer is now pushing further into the hardware business itself, even as supply chains strain under the weight of the AI infrastructure buildout.
2026-06-30
digitimes.com
2026-06-30
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.
2026-06-30
digitimes.com
2026-06-30
Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.
2026-06-30
digitimes.com
2026-06-30
Hurun Research Institute released its Hurun Global Unicorn List on June 25, a ranking covering 1,603 companies across 52 countries and 299 cities. The number of companies is up 5.3% from the prior year, while total global unicorn value has surged 43% year on year to US$8 trillion, far outpacing growth in the number of companies.
2026-06-30
digitimes.com
2026-06-30
Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.
2026-06-30
digitimes.com
2026-06-30
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are rising, demand is hard to gauge, and companies are preparing for customer stockpiling that could keep chip orders elevated into the third quarter.
2026-06-30
digitimes.com
2026-06-30
China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.
2026-06-30
digitimes.com
2026-06-30
Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.
2026-06-30
digitimes.com
2026-06-30
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
2026-06-30
digitimes.com
2026-06-30
Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMESanalyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.
2026-06-30
digitimes.com
2026-06-30
South Korea's inventories of high-purity carbon dioxide, a critical material used in advanced semiconductor manufacturing, have fallen below normal buffer levels, raising procurement concerns across the chip industry, according to The Elec.
2026-06-30
digitimes.com
2026-06-30
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
2026-06-30
digitimes.com
2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-30
digitimes.com
2026-06-30
For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down memory and component costs before turning hardware upgrades into high-margin revenue. The AI-driven boom in HBM and DRAM is now challenging that strategy.
2026-06-30
digitimes.com
2026-06-30
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a re
2026-06-30
digitimes.com
2026-06-30
Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bellreported, citing industry sources.
2026-06-30
digitimes.com
2026-06-30
Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China, Hong Kong, and Macau, launching a second round of raids targeting Supermicro's Taiwan branch and two listed Taiwanese technology companies.
2026-06-30
digitimes.com
2026-06-30
Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.