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Trending Companies
NVIDIA152 TSMC60 SK Hynix55 Micron Technology45 Samsung44 Micron37 Infineon31 Samsung Electronics29 Microsoft28 SK hynix25 Apple23 Intel22 AMD22 SanDisk20 Google19
Trending Technologies
EUV140 3nm115 AI52 HBM50 AI chips47 DRAM45 GPU41 NAND flash24 memory chips20 advanced packaging17 AI infrastructure17 semiconductor12 HBM410 data centers10 data center9
2026-07-05
Germany Opens World's Largest Smart Power Semiconductor Factory with €5 Billion Investment, Creating 1,000 Jobs and Doubling Capacity for AI and Energy Needs - CPG Click Oil and Gas
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news.google.com 2026-07-05 CPG Click Oil and Gas
2026-07-05
Micron Risks Falling Out of the Trillion-Dollar Club. AMD Stock Has a Clear Path to Joining. - Yahoo Finance
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news.google.com 2026-07-05 Yahoo Finance
2026-07-05
Micron Risks Falling Out of the Trillion-Dollar Club. AMD Stock Has a Clear Path to Joining. - Barchart
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news.google.com 2026-07-05 Barchart
2026-07-05
Infineon Technologies outlines long-term strategy as semiconductor demand evolves - AD HOC NEWS
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news.google.com 2026-07-05 AD HOC NEWS
2026-07-05
European Union Semiconductor Sealing Products - Market Analysis, Forecast, Size, Trends and Insights - IndexBox
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news.google.com 2026-07-05 IndexBox
2026-07-05
Asia-Pacific Semiconductor Cooling Fluids - Market Analysis, Forecast, Size, Trends and Insights - IndexBox
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news.google.com 2026-07-05 IndexBox
2026-07-05
Synopsys Inc. outlines its role in chip design as investors track long term growth - AD HOC NEWS
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news.google.com 2026-07-05 AD HOC NEWS
2026-07-05
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
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digitimes.com 2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
Live coverage: Semiconductor manufacturing test bed to fly alongside Starlink satellites on Falcon 9 launch - Spaceflight Now
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news.google.com 2026-07-05 Spaceflight Now
2026-07-04
Meta data center water discharges suspended after contaminating the city's water supply with bacterium
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tomshardware.com 2026-07-04 Luke James
Fill-and-flush is a commissioning step whereby crews fill a cooling loop's piping with water and flush it to clear debris before the system is run.
data centerwater managementbacterial contaminationenvironmental compliancewater treatmentAI data centerdata center coolingmunicipal water supply
2026-07-04
Kinsus Interconnect Tech outlines its role in advanced packaging. The company positions for long-ter - Ad-hoc-news.de
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www.ad-hoc-news.de 2026-07-04 Ad-hoc-news.de
2026-07-04
Windows guru uses Stirling Engine to cool AMD Threadripper 3970X
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tomshardware.com 2026-07-04 Mark Tyson
Windows development guru Dave W. Plummer shared a brief video demonstrating a novel Stirling Engine powered cooling solution for his AMD Threadripper chipset.
Stirling EngineAMD ThreadripperCPU CoolingHardware ModificationOpen SourceThermal ManagementDIY HardwareComputer Hardware
2026-07-04
Linux 7.2-rc2 Raising The Default RISC-V 64-bit CPU Limit To 256 Cores - Phoronix
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www.phoronix.com 2026-07-04 Phoronix
2026-07-04
Fire hydrant signs with Starlink antennas tested for emergency Wi-Fi in disaster-prone Japan
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tomshardware.com 2026-07-04 Mark Tyson
Japan’s Fire Hydrant Sign Co., Ltd. has demonstrated an expansive Wi-Fi network that melds its established infrastructure of street signs with Starlink satellite broadband antennas.
Fire hydrantStarlinkEmergency communicationSatellite internetDisaster responseWi-Fi networkInfrastructure upgradeJapan technology
2026-07-04
In-Line Fluid Sensor Market Forecast Points Higher Toward 2035, Driven by Semiconductor Automation Demands - IndexBox
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www.indexbox.io 2026-07-04 IndexBox
2026-07-04
ANSYS Inc. outlines long-term simulation growth as investors weigh strategy - Ad-hoc-news.de
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news.google.com 2026-07-04 Ad-hoc-news.de
2026-07-04
TSMC's median pay trails four smaller IC design houses, filings show
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digitimes.com 2026-07-04
Fabless chip designers dominate the upper ranks of Taiwan's newly disclosed non-managerial employee pay data for fiscal year 2025, with only two capital-intensive manufacturers — TSMC and memory-testing equipment maker Phison — breaking into the top tier typically reserved for asset-light IC design houses.
2026-07-04
Infineon wins fourth German patent ruling against Innoscience, as GaN fight flares in Shanghai
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digitimes.com 2026-07-04
Germany's District Court Munich I ruled on July 3 that Innoscience infringed Infineon Technologies' gallium nitride (GaN) patents, barring the Chinese chipmaker from importing, selling, or marketing the affected products in Germany and ordering it to pay damages.
2026-07-04
China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes
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digitimes.com 2026-07-04
China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and partners that it will raise prices across its entire product lineup starting July 1, with increases beginning at 15%.
2026-07-03
Intel reportedly adding two new 22-core SKUs with game-boosting cache to Nova Lake-S lineup
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tomshardware.com 2026-07-03 Hassam Nasir
Midrange offerings with a lot of cache.
IntelNova LakeCPU architectureGaming performanceCache technology3D V-CacheCore UltraP-core E-core