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2026-05-07
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GoogleNews
Google Pixel 11 series specs detailed: 2nm-based chip, new image sensors
By Debasish -
May 6, 2026
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Google’s next Pixel lineup is starting to leak in detail. A large spec dump has now revealed information across the entire Pixel 11 lineup. The focus this time seems to be a few hardware changes that are a little unexpec
digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se